High Performance RF Filters for 5G/6G Applications Using Double Side Pattern and Bonding Technique

Speaker Information

Duan Feng

Duan Feng

NEWSONIC, China

Abstract

NEWSONIC's D-BAW technology achieves high-performance BAW filters through double-sided patterning and double-sided bonding processes. Thanks to the development of MEMS processing technologies, especially bonding technologies, over the past two decades, the core Mo/AlN/Mo sandwich structure of D-BAW adopts a monolithic film deposition method. This eliminates the adverse effects of a series of processes such as patterning and etching after the deposition of each film layer on film quality, resulting in better uniformity of the grown thin films. In addition, the ultra-flat piezoelectric film reduces the risk of piezoelectric film fracture. The double-sided patterning process further enables heterogeneous substrate integration to be compatible with novel piezoelectric materials such as thin-film lithium niobate, expanding the application scenarios for large bandwidths. Furthermore, our D-BAW technology supports a variety of glass wafer-level packaging technologies to further reduce the overall device cost, thus providing key technical support for the 5G/6G communication fields.

Speaker Biography

Duan Feng received his Ph.D. in Microelectronics from the Shanghai Institute of Microsystems (SIMIT), Chinese Academy of Sciences (CAS). During his doctoral studies, he carried out research on CMOS-MEMS manufacturing technology and phononic crystal nanomaterials at the National Key Laboratory of Sensor Technology. Since 2016, he has been engaged in the RF filter industry and has served in managerial and technical expert positions at several enterprises. He has extensive experience in semiconductor processes, wireless communication systems, MEMS Modeling, and materials physics. After joining NEWSONIC, his team developed the double-sided patterned and bonded BAW technology (D-BAW) and put it into mass production. He has also been engaged in NEWSONIC's SAW technology research and helped build the design and process platform for SAW. He holds dozens of invention patents about MEMS process, RF Acoustic filters.

Key Achievements:

  • Developed D-BAW (double-sided patterned and bonded BAW) technology and put it into mass production
  • Extensive experience in semiconductor processes and wireless communication systems
  • Expertise in MEMS modeling and materials physics
  • Dozens of invention patents in MEMS process and RF acoustic filters
  • Contributed to building SAW design and process platform at NEWSONIC